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Circuit design imprinting onto wafers
Clean wafers
Cleaning product
Cleaning wafers
DUV wafer stepper
Deep UV wafer stepper
Deep ultraviolet wafer stepper
Detergent
Detergent industry
Detergents
Imprint circuit design onto wafers
Imprinting of wafers with circuit design
Lap wafers
Lapping wafers
NORDPOLBDE
Nordic-Polish brigade
Polish wafers
Polish-Ukrainian peacekeeping battalion
Polishing and scouring preparations
Polishing end
Polishing section
Polishing shop
Powdex condensate polishing equipment
Powdex condensate polishing plant
Powdex polishing system
Semiconductor wafer cleaning
Semiconductor wafer cleansing
Slice
Use photolithography
Wafer
Wafer lapping

Übersetzung für "polish wafers " (Englisch → Deutsch) :

TERMINOLOGIE
lap wafers | wafer lapping | lapping wafers | polish wafers

Wafer polieren


cleaning wafers | semiconductor wafer cleansing | clean wafers | semiconductor wafer cleaning

Wafer reinigen | Wafer säubern


deep ultraviolet wafer stepper | deep UV wafer stepper | DUV wafer stepper

Stepper im tiefen Ultraviolett-Bereich | Waferstepper im fernen UV-Bereich


circuit design imprinting onto wafers | imprinting of wafers with circuit design | imprint circuit design onto wafers | use photolithography

Schaltungsentwürfe auf Wafer aufdrucken


polishing end | polishing section | polishing shop

Polierende | Poliererei


Powdex condensate polishing equipment | Powdex condensate polishing plant | Powdex polishing system

Powdex-Kondensatentsalzungsanlage




polishing and scouring preparations [ cleaning product | detergent | Detergent industry(STW) | Detergents(STW) ]

Reinigungsmittel [ Detergens | Pflegemittel | Putzmittel | Wasch- und Reinigungsmittel ]


Nordic-Polish brigade | NORDPOLBDE

nordisch-polnische Brigade | NORDPOLBDE


Polish-Ukrainian peacekeeping battalion

polnisch-ukrainisches Peacekeeping Bataillon
IN-CONTEXT TRANSLATIONS
It is fitted on the carrier head of an interchangeable tool of such machines and is used to planarise/flatten and polish the wafers.

Es wird auf dem Trägerkopf eines auswechselbaren Werkzeugs solcher Maschinen angebracht, um die Wafers zu ebnen, zu glätten und zu polieren.


(b) under heading No 38.19 if in the form of discs, wafers and the like, cut from the products described in (a), whether or not polished;

b) in Form von Scheiben, Plättchen, Rondellen und dergleichen, durch Schneiden der unter a) genannten Erzeugnisse hergestellt, auch poliert, nach Nr. 38. 19


if in the form of discs, wafers and the like, cut from the products described in (a), whether or not polished.

wenn es in Form von Scheiben, Plättchen, Rondellen und dergleichen, durch Schneiden der unter a) genannten Erzeugnisse hergestellt, auch poliert, gestellt wird.


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